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Conference paper

All-in-One Haptic Thimble for Vibration, Pressure, and Thermal Feedback: Investigating the Impact of Vibration Frequency on Thermal Perception

Mohammad Shadman Hashem, Ahsan Raza, Seokhee Jeon

IEEE World Haptics Conference (WHC) 2025, Suwon, Korea, 2025

IEEE XploreWebsite
Hashem, M. S., Raza, A., & Jeon, S. (2025). All-in-One Haptic Thimble for Vibration, Pressure, and Thermal Feedback: Investigating the Impact of Vibration Frequency on Thermal Perception. In IEEE World Haptics Conference (WHC) 2025, Suwon, Korea. https://doi.org/10.1109/whc64065.2025.11123341

BibTeX

@inproceedings{hashem2025haptic,
  title = {{All-in-One Haptic Thimble for Vibration, Pressure, and Thermal Feedback: Investigating the Impact of Vibration Frequency on Thermal Perception}},
  author = {Hashem, Mohammad Shadman and Raza, Ahsan and Jeon, Seokhee},
  booktitle = {IEEE World Haptics Conference (WHC) 2025, Suwon, Korea},
  year = {2025},
  doi = {10.1109/whc64065.2025.11123341},
  url = {https://ieeexplore.ieee.org/abstract/document/11123341}
}