Yong Hea Heo, Gyubin An, Hyun-Jeong Kim, Sang-Youn Kim, Mohammad Shadman Hashem, Seokhee Jeon, Dong-Soo Choi
IEEE World Haptics Conference (WHC) 2023, 2023
@inproceedings{heo2023wireless,
title = {{Wireless Dual Mode Haptic Thimble based on Magnetoactive Rubber}},
author = {Heo, Yong Hea and An, Gyubin and Kim, Hyun-Jeong and Kim, Sang-Youn and Hashem, Mohammad Shadman and Jeon, Seokhee and Choi, Dong-Soo},
booktitle = {IEEE World Haptics Conference (WHC) 2023},
year = {2023},
doi = {10.1109/whc56415.2023.10224377},
url = {https://ieeexplore.ieee.org/abstract/document/10224377}
}